About SIMS
The research group for Sensor Integration in Mechatronic Systems (SIMS) focuses on the modelling, design and single-chip integration of sensor modules, based on CMOS, BiCMOS and PIC technologies for the following topics
- Integrated electronic frontends for sensor actuation and reading
- Data conditioning and signal processing
- RF wireless and wireline communication interfaces
- Sensor integration (e.g. photonic sensors, capactitive sensors, temperature sensors, etc.).
SIMS is is part of the research center CIME (Carinthia Institute for Microlectronics) and specializes in the design of analog and digital integrated circuits, RF and high-speed integrated circuits, high-level modelling of integrated systems (SoC’s) and EM field simulations.
The research group SIMS is Member of
CIME – Carinthia Institute for Microelectronics
The Carinthia Institute for Microelectronics (CIME) is a competence center for research and development of integrated electronic systems. CIME is strongly associated to the department of Integrated Systems and Circuits Design (ISCD) with a srong network to other department within the faculty of Engineering & IT at Carinthia University of Applied Sciences.
Projects
CapSize
System-on-Chip (SoC) integration of sensing electronics for capacitive sensor arrays in flexible skins enables realization of embedded multi-sensor networks for proximity and gesture sensing in collaborative robotics applications.
Pattern-Skin
ASIC development in 65nm CMOS for capacitive sensing electronic arrays in collaborative robotics, including electrode driver, receiver, Analog-to-Digital conversion, signal procesing and communication interface.
CoRaLi-DAR
The EU-funded project CoRaLi-DAR aims at integrating in the same module both radio and light-based sensing, exploiting LiDAR’s high-resolution capabilities and RADAR’s strong reliability in adverse weather conditions. The full integration of photonics and electronics will reduce manufacturing cost and operational power.
ChipLink-TRX
Research on high-speed chip-to-chip (Chiplet) data communication links for System-in-Package (SiP) chip integration. The tasks include full-duplex single-ended chiplet transceiver architectures, data crosstalk cancellation and Chiplet data channel design modeling and optimization.
Facilitate
In the Facilitate project we develop a platform for additively manufactured (AM) smart systems with integrated electronic sensors and green precursors, including bio-materials. Facilitate will demonstrate a use case of a AM manufactured, multi-material anatomical model including an integrated capacitive sensing ASIC for signal processing data communication and developed by CIME.
Contact
SIMS – Research group
for Sensor Integrations in Mechatronic Systems
Carinthia University of Applied Science
Europastrasse 4, 9500 Villach, Austria
FH-Prof. Dr. Johannes Sturm
Lead: SIMS
j.sturm[at]fh-kaernten.at
Employee profile
Team
Respect is part of the CIME research center, you can find the team list here: go to the CIME team page
Partner/Cooperation
Graz University of Technology, Johannes Kepler University Linz, University of Klagenfurt,
Silicon Austria Labs, Joanneum Research
Infineon Technologies, Intel, Sensideon